What is Drop Test?
Drop testing is a common product quality inspection method used to assess the durability and reliability of products when subjected to accidental drops during transportation, storage and use.
Our free drop test is to simulate the impact of environmental stresses on the product during use, to examine the product's ability to withstand accidental impacts and to determine the product's adaptability to accidental falls during use.
Instruments used in the process of accidentally falling from a high place (such as desktop, countertop, etc.) to the ground, the product shell rupture, scratches, or even completely shattered, the product quality will have an impact on the product quality, can not be used normally. Seriously may cause the screen broken, the internal components of the product fall off, and the instruments can only be scrapped.
Test Conditions
The normal portable devices have to be freely dropped from height of 1.22 meters for total of 26 drops on each side, edge and corner of the sample. The direction and number of drops are determined by the weight and size of the product.
Test Results
1. After the test, there is no crack or damage to the appearance and structure of the shell and instrument.
2. After the test, the instrument can be turned on normally, and the functions of buttons, display and interface are normal. The instrument can measure normally with good performance.
PM5 Gen2 ultrasonic thickness meter is an advanced ultrasonic thickness gauge with a wide range of standard measurement functions and functional options developed by YUSHI innovation. It is used to measure the thickness of materials, such as: steel, stainless steel, aluminum, copper, chrome alloy and other metal materials, and plastics, rubber, ceramics, glass and other non-metals. The instrument is widely used in various fields such as petroleum, chemical, electric power, boiler, metallurgy, shipbuilding, aviation, aerospace, etc. The PM5 Gen2 passes the drop test, which ensures that the instrument maintains its functional integrity and structural stability in various real-world usage scenarios.